ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Check out high demanding part numbers 5E8071 253-APP-1403, 5E8071 253C1403, ROM PROM FAMILY 007, M38510/20902BVB, S82S185I 883B under NSN 5962-01-221-2782 of Microcircuit Memory manufactured by Hamilton Sundstrand Corporation, Dla Land And Maritime, Military Specifications, Philips Semiconductors Ltd.
Federal Supply Class of NSN 5962-01-221-2782 is FSC 5962 contains part details of Microcircuits Electronic. Quote for your desired part numbers.
| Item Name | Microcircuit Memory |
| INC Code | 41015 |
| Federal Supply Group (FSG) | Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC) | 5962 Microcircuits Electronic |
| National Item Identification Number (NIIN) | 01-221-2782 (012212782) |
| NCB Code | USA (01) |
| Manufacturer | Hamilton Sundstrand Corporation, Dla Land And Maritime, Military Specifications, Philips Semiconductors Ltd |
| Associated Parts Numbers of NSN 5962-01-221-2782 | ||||||
|---|---|---|---|---|---|---|
| Part Number | Manufacturer | Item Name | Cage Code | Type | Status | RFQ |
| 5E8071 253-APP-1403 | hamilton sundstrand corporation | microcircuit memory | 73030 | A | A | RFQ |
| 5E8071 253C1403 | hamilton sundstrand corporation | microcircuit memory | 73030 | A | A | RFQ |
| ROM PROM FAMILY 007 | dla land and maritime | microcircuit memory | 16236 | A | A | RFQ |
| M38510/20902BVB | military specifications | microcircuit memory | 81349 | NSN | Avl | RFQ |
| S82S185I 883B | philips semiconductors ltd | microcircuit memory | 18324 | A | F | RFQ |
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 0.930 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.310 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.120 INCHES MAXIMUM |
| AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | BIPOLAR AND PROGRAMMABLE AND MONOLITHIC |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 12 INPUT |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 7.0 VOLTS MAXIMUM POWER SOURCE |
| CZER | MEMORY DEVICE TYPE | ROM |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD INCLUDES INDUSTRY OR ASSOCIATION STANDARDS,INDIVIDUAL MANUFACTUREER STANDARDS,ETC.). |
| TTQY | TERMINAL TYPE AND QUANTITY | 18 PRINTED CIRCUIT |
| Relevant Components for NSN - 5962-01-221-2782, 5962012212782 | ||||
| 5905-00-000-0136 (5905000000136) | 5905-00-001-2573 (5905000012573) | 5905-00-001-2812 (5905000012812) | 5905-00-001-2813 (5905000012813) | |
| 5905-00-001-2814 (5905000012814) | 5905-00-001-2815 (5905000012815) | 5905-00-001-2818 (5905000012818) | 5905-00-001-2819 (5905000012819) | |
| 5905-00-001-2821 (5905000012821) | 5905-00-001-2822 (5905000012822) | 5905-00-001-2826 (5905000012826) | 5905-00-001-2827 (5905000012827) | |
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AS 6081:2012 Certification |
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ESD S20.20-2014 Certification |
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