ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Check out high demanding part numbers F17006404, IDT7M864L120CB, F52001708, HM6264LP-12, 725004-944 under NSN 5962-01-259-2035 of Microcircuit Memory manufactured by Wespercorp Fsg Inc, Integrated Device Technology Inc, Hitachi Magnetics Corp, Fsg Inc, Raytheon Company.
Federal Supply Class of NSN 5962-01-259-2035 is FSC 5962 contains part details of Microcircuits Electronic. Quote for your desired part numbers.
| Item Name | Microcircuit Memory |
| INC Code | 41015 |
| Federal Supply Group (FSG) | Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC) | 5962 Microcircuits Electronic |
| National Item Identification Number (NIIN) | 01-259-2035 (012592035) |
| NCB Code | USA (01) |
| Manufacturer | Wespercorp Fsg Inc, Integrated Device Technology Inc, Hitachi Magnetics Corp, Fsg Inc, Raytheon Company |
| Associated Parts Numbers of NSN 5962-01-259-2035 | ||||||
|---|---|---|---|---|---|---|
| Part Number | Manufacturer | Item Name | Cage Code | Type | Status | RFQ |
| F17006404 | wespercorp fsg inc | microcircuit memory | 6z076 | A | F | RFQ |
| IDT7M864L120CB | integrated device technology inc | microcircuit memory | 61772 | A | A | RFQ |
| F52001708 | wespercorp fsg inc | microcircuit memory | 6z076 | A | F | RFQ |
| HM6264LP-12 | hitachi magnetics corp | microcircuit memory | 52531 | A | H | RFQ |
| F52001708 | fsg inc | microcircuit memory | 65519 | A | F | RFQ |
| 725004-944 | raytheon company | microcircuit memory | 05869 | A | A | RFQ |
| F17006404 | fsg inc | microcircuit memory | 65519 | A | F | RFQ |
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 1.400 INCHES NOMINAL |
| ADAT | BODY WIDTH | 0.594 INCHES NOMINAL |
| ADAU | BODY HEIGHT | 0.280 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 4.0 WATTS |
| AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | LOW POWER AND HERMETICALLY SEALED AND HIGH SPEED AND MONOLITHIC |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 23 INPUT |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE |
| CZEQ | TIME RATING PER CHACTERISTIC | 120.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME,LOW TO HIGH LEVEL OUTPUT AND 120.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME,HIGH TO LOW LEVEL OUTPUT |
| CZER | MEMORY DEVICE TYPE | RAM |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD INCLUDES INDUSTRY OR ASSOCIATION STANDARDS,INDIVIDUAL MANUFACTUREER STANDARDS,ETC.). |
| TTQY | TERMINAL TYPE AND QUANTITY | 28 PRINTED CIRCUIT |
| Relevant Components for NSN - 5962-01-259-2035, 5962012592035 | ||||
| 5905-00-000-0136 (5905000000136) | 5905-00-001-2573 (5905000012573) | 5905-00-001-2812 (5905000012812) | 5905-00-001-2813 (5905000012813) | |
| 5905-00-001-2814 (5905000012814) | 5905-00-001-2815 (5905000012815) | 5905-00-001-2818 (5905000012818) | 5905-00-001-2819 (5905000012819) | |
| 5905-00-001-2821 (5905000012821) | 5905-00-001-2822 (5905000012822) | 5905-00-001-2826 (5905000012826) | 5905-00-001-2827 (5905000012827) | |
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AS9120B and ISO 9001:2015 |
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Aviation Suppliers Association Member |
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FAA AC 0056B Accredited |
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AS 6081:2012 Certification |
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ESD S20.20-2014 Certification |
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