ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Check out high demanding part numbers IDT6116SA150DB, 351-5642-042, 6116S150DB, 47185-01, 9481-00085 under NSN 5962-01-270-3486 of Microcircuit Memory manufactured by Epson Electronics America Inc, Rockwell Collins Aerospace, Integrated Device Technology Inc, Industrial Electronic Engineers, Bae Systems Inc.
Federal Supply Class of NSN 5962-01-270-3486 is FSC 5962 contains part details of Microcircuits Electronic. Quote for your desired part numbers.
| Item Name | Microcircuit Memory |
| INC Code | 41015 |
| Federal Supply Group (FSG) | Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC) | 5962 Microcircuits Electronic |
| National Item Identification Number (NIIN) | 01-270-3486 (012703486) |
| NCB Code | USA (01) |
| Manufacturer | Epson Electronics America Inc, Rockwell Collins Aerospace, Integrated Device Technology Inc, Industrial Electronic Engineers, Bae Systems Inc, Hitachi America Ltd |
| Associated Parts Numbers of NSN 5962-01-270-3486 | ||||||
|---|---|---|---|---|---|---|
| Part Number | Manufacturer | Item Name | Cage Code | Type | Status | RFQ |
| IDT6116SA150DB | epson electronics america inc | microcircuit memory | 61722 | A | A | RFQ |
| 351-5642-042 | rockwell collins aerospace | microcircuit memory | 13499 | A | A | RFQ |
| 6116S150DB | integrated device technology inc | microcircuit memory | 61772 | A | A | RFQ |
| 47185-01 | industrial electronic engineers | microcircuit memory | 05464 | A | A | RFQ |
| 9481-00085 | bae systems inc | microcircuit memory | k0656 | F | A | RFQ |
| IDT6116SA150DB | integrated device technology inc | microcircuit memory | 61772 | A | A | RFQ |
| HM6116-3 | hitachi america ltd | microcircuit memory | 62786 | F | A | RFQ |
| MRC | Criteria | Characteristic |
|---|---|---|
| AEHX | MAXIMUM POWER DISSIPATION RATING | 550.0 MILLIWATTS |
| AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | STATIC OPERATION AND HIGH SPEED AND ASYNCHRONOUS |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 14 INPUT |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 5.0 VOLTS NOMINAL POWER SOURCE |
| CZEQ | TIME RATING PER CHACTERISTIC | 150.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME,LOW TO HIGH LEVEL OUTPUT |
| CZER | MEMORY DEVICE TYPE | ROM |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD INCLUDES INDUSTRY OR ASSOCIATION STANDARDS,INDIVIDUAL MANUFACTUREER STANDARDS,ETC.). |
| TTQY | TERMINAL TYPE AND QUANTITY | 24 PRINTED CIRCUIT |
| Relevant Components for NSN - 5962-01-270-3486, 5962012703486 | ||||
| 5905-00-000-0136 (5905000000136) | 5905-00-001-2573 (5905000012573) | 5905-00-001-2812 (5905000012812) | 5905-00-001-2813 (5905000012813) | |
| 5905-00-001-2814 (5905000012814) | 5905-00-001-2815 (5905000012815) | 5905-00-001-2818 (5905000012818) | 5905-00-001-2819 (5905000012819) | |
| 5905-00-001-2821 (5905000012821) | 5905-00-001-2822 (5905000012822) | 5905-00-001-2826 (5905000012826) | 5905-00-001-2827 (5905000012827) | |
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