ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Check out high demanding part numbers 391-0351-032, ROM PROM HEAD 264, PALC22V10H-30MJS883B, 5962-8867002LX, PALC22V10-30DMB under NSN 5962-01-339-7104 of Microcircuit Memory manufactured by Rockwell Collins Aerospace, Dla Land And Maritime, Mmi Amd, Cypress Semiconductor Inc, General Dynamics Land Systems Inc.
Federal Supply Class of NSN 5962-01-339-7104 is FSC 5962 contains part details of Microcircuits Electronic. Quote for your desired part numbers.
| Item Name | Microcircuit Memory |
| INC Code | 41015 |
| Federal Supply Group (FSG) | Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC) | 5962 Microcircuits Electronic |
| National Item Identification Number (NIIN) | 01-339-7104 (013397104) |
| NCB Code | USA (01) |
| Manufacturer | Rockwell Collins Aerospace, Dla Land And Maritime, Mmi Amd, Cypress Semiconductor Inc, General Dynamics Land Systems Inc |
| Associated Parts Numbers of NSN 5962-01-339-7104 | ||||||
|---|---|---|---|---|---|---|
| Part Number | Manufacturer | Item Name | Cage Code | Type | Status | RFQ |
| 391-0351-032 | rockwell collins aerospace | microcircuit memory | 13499 | A | A | RFQ |
| ROM PROM HEAD 264 | dla land and maritime | microcircuit memory | 16236 | A | A | RFQ |
| PALC22V10H-30MJS883B | mmi amd | microcircuit memory | 50364 | A | F | RFQ |
| 5962-8867002LX | dla land and maritime | microcircuit memory | 67268 | M | A | RFQ |
| PALC22V10-30DMB | cypress semiconductor inc | microcircuit memory | 65786 | A | A | RFQ |
| 5962-8867002LB | dla land and maritime | microcircuit memory | 67268 | M | A | RFQ |
| 7573733-300 | general dynamics land systems inc | microcircuit memory | 13160 | F | A | RFQ |
| 5962-8867002LA | dla land and maritime | microcircuit memory | 67268 | M | A | RFQ |
| 351-5866-012 | rockwell collins aerospace | microcircuit memory | 13499 | A | A | RFQ |
| 5962-88670 | dla land and maritime | microcircuit memory | 67268 | M | A | RFQ |
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 1.280 INCHES MAXIMUM |
| AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS |
| CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | D-9 MIL-M-38510 |
| AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CQZP | INPUT CIRCUIT PATTERN | 22 INPUT |
| CTQX | CURRENT RATING PER CHARACTERISTIC | 16.00 MILLIAMPERES NOMINAL OUTPUT SINK |
| TTQY | TERMINAL TYPE AND QUANTITY | 24 PRINTED CIRCUIT |
| ADAT | BODY WIDTH | 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.185 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 1.2 WATTS |
| CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -0.5 VOLTS MAXIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE |
| CZEQ | TIME RATING PER CHACTERISTIC | 30.00 NANOSECONDS MAXIMUM ACCESS |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND PROGRAMMED AND POSITIVE OUTPUTS |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CXCY | PART NAME ASSIGNED BY CONTROLLING AGENCY | AND-OR LOGIC ARRAY |
| CZER | MEMORY DEVICE TYPE | PAL |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD INCLUDES INDUSTRY OR ASSOCIATION STANDARDS,INDIVIDUAL MANUFACTUREER STANDARDS,ETC.). |
| Relevant Components for NSN - 5962-01-339-7104, 5962013397104 | ||||
| 5905-00-000-0136 (5905000000136) | 5905-00-001-2573 (5905000012573) | 5905-00-001-2812 (5905000012812) | 5905-00-001-2813 (5905000012813) | |
| 5905-00-001-2814 (5905000012814) | 5905-00-001-2815 (5905000012815) | 5905-00-001-2818 (5905000012818) | 5905-00-001-2819 (5905000012819) | |
| 5905-00-001-2821 (5905000012821) | 5905-00-001-2822 (5905000012822) | 5905-00-001-2826 (5905000012826) | 5905-00-001-2827 (5905000012827) | |
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AS9120B and ISO 9001:2015 |
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Aviation Suppliers Association Member |
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FAA AC 0056B Accredited |
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AS 6081:2012 Certification |
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ESD S20.20-2014 Certification |
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